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導熱絕緣硅膠片的優點及性能

發布時間:2014-05-09 文章作者:admin

導熱絕緣硅膠片的優點及性能
The advantages and properties of silicon film thermal insulation

**降低散熱器以及散熱結構件的工藝工差要求,彌合結構工藝工差**
** reduce the radiator and radiating structure of the process requirements, bridge structure technology and difference**

導熱硅膠片厚度,軟硬度可根據設計的不同進行調節,因此在導熱通道中可以彌合散熱結構,芯片等尺寸工差,降低對結構設計中對散熱器件接觸面的工差要求,特別是對平面度,粗糙度的工差,目前行業內高良率的散熱器加工尺寸工差為+/-0.25mm,平面度為0.15mm/30mmx30mm,如果提高加工精度則會在很大程度上提高產品成本,因此導熱硅膠片可以充分增大發熱體與散熱器件的接觸面積,降低了散熱器的生產成本。 除了傳統的PC行業,現在新的散熱方案就是去掉傳統的散熱器,將結構件和散熱器統一成散熱結構件。在PCB布局中將散熱芯片布局在背面,或在正面布局時,在需要散熱的芯片周圍開散熱孔,將熱量通過銅箔等導到PCB背面,然后通過導熱硅膠片填充建立導熱通道導到PCB下方或側面的散熱結構件(金屬支架,金屬外殼),對整體散熱結構進行優化,同時也降低整個散熱方案的成本.
Thermal conductivity of silica gel film thickness, hardness can be adjusted according to the different design, so it can bridge the radiating structure in the conduction channel, chip size tolerance, reduce the requirements on the contact surface of the radiator industry structure design, especially for flatness, roughness of the working poor, the processing size industrial radiator industry high yield difference is +/-0.25mm, the flatness is 0.15mm/30mmx30mm, if improve machining accuracy will increase the product cost to a great extent, the contact area of the thermal conductivity of silica gel film can increase the heating unit and the cooling device, reduce the production cost of the radiator. In addition to the traditional PC industry, now the new cooling solution is to remove the traditional radiator, the radiator structure and unified into the radiating structure. In the PCB layout, radiating chip layout on the back, or in front of the layout, opened with the heat dissipation holes around the need to heat the chip, through the copper conducting heat back to the PCB, and then through the heat conducting silicon film filling the establishment of thermal channel guide to the radiating structure below PCB or side (metal stents, metal shell), for optimization on the whole radiating structure, but also reduce the cooling solution cost.

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